← CAPABILITIES
HIGH-DENSITY COMPUTE

Density Designed In, Not Retrofitted

GPU-dense AI workloads break facilities designed for enterprise IT. We engineer the rack, thermal, and power architecture together from inception, so density is a starting assumption rather than an upgrade path.

50–150
KW PER RACK
2-PHASE
DIRECT-TO-CHIP READY
N+1 / 2N
REDUNDANCY TOPOLOGY
AI
DENSITY-FIRST DESIGN
ENVIRONMENT SPECIFICATIONS

Engineered for GPU-Dense Workloads

TECHNICAL SPECIFICATIONS
RACK DENSITY50 kW – 150 kW+ per rack
COOLINGAir · Liquid · 2-Phase DTC
HEAT REJECTIONFacility water, dry cooler, or hybrid
REDUNDANCYN+1 / 2N topology
POWER DISTRIBUTIONBusway, high-amperage rack PDU
FABRICHigh-radix, low-latency AI fabric
DEPLOYMENTModular · Greenfield · Brownfield
VALIDATIONThermal & load verification at handover
THERMAL BUDGET FIRST

Rack density is a thermal decision before it is an IT decision. We fix the heat rejection path — coolant temperatures, approach, flow, and failure behavior — before rack layout is committed, because retrofitting that path is the most expensive mistake in AI infrastructure.

POWER AT DENSITY

At 100kW a rack, distribution losses, harmonic behavior, and fault clearing stop being footnotes. We engineer distribution topology and protection coordination against the real density target, not a de-rated average.

DEPLOYABLE ACROSS MODELS

The same density architecture is delivered into new builds, retrofits, and modular units. The engineering is portable; only the envelope changes.

DENSITY ENGINEERING

How We Get to Density

01

Workload & Density Modeling

We start from the accelerator platform and utilization profile to derive real per-rack power and heat load, including transient behavior under training bursts.

02

Thermal Path Design

Coolant loops, distribution units, manifolds, and heat rejection are designed as one path with defined approach temperatures and failure modes.

03

Power & Fabric Architecture

Distribution topology, redundancy, protection coordination, and network fabric are engineered against the committed density target.

04

Integrated Thermal & Load Validation

Commissioning verifies the environment at design density under load — thermal performance, redundancy behavior, and failover, documented before handover.

GET IN TOUCH

Scoping a High-Density Build?

Tell us the accelerator platform and the density target. We will model the thermal and power envelope required to support it.

Single point of contact, end to end.